NXP Semiconductors - SPC5566MZP80

SPC5566MZP80 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number SPC5566MZP80
Description MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 416; Package Code: BGA; Package Shape: SQUARE;
In Stock1,908
NAME DESCRIPTION
Minimum Supply Voltage: 1.35 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.5 V
Maximum Time At Peak Reflow Temperature (s): 40
Sub-Category: Microcontrollers
Surface Mount: YES
Maximum Supply Current: 545 mA
ADC Channels: YES
No. of Terminals: 416
DMA Channels: YES
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
No. of I/O Lines: 256
Address Bus Width: 24
Screening Level: AEC-Q100
Technology: CMOS
JESD-30 Code: S-PBGA-B416
Maximum Clock Frequency: 20 MHz
Package Shape: SQUARE
ROM Words: 3145728
Terminal Form: BALL
Maximum Operating Temperature: 125 Cel
Package Code: BGA
Width: 27 mm
Moisture Sensitivity Level (MSL): 3
Speed: 82 rpm
Peripheral IC Type: MICROCONTROLLER, RISC
Maximum Supply Voltage: 1.65 V
RAM Bytes: 131072
External Data Bus Width: 32
Bit Size: 32
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA416,26X26,40
Length: 27 mm
PWM Channels: YES
Peak Reflow Temperature (C): 260
ROM Programmability: FLASH
Terminal Pitch: 1 mm
Temperature Grade: AUTOMOTIVE
Power Supplies (V): 1.5,3.3,5
CPU Family: E200
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Pricing (USD)

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