NXP Semiconductors - SPC5673FF3MVV2

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SPC5673FF3MVV2 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number SPC5673FF3MVV2
Description Microcontrollers; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE;
Datasheet SPC5673FF3MVV2 Datasheet
In Stock2,153
NAME DESCRIPTION
Package Body Material: PLASTIC
Maximum Time At Peak Reflow Temperature (s): 30
Sub-Category: Microcontrollers
Surface Mount: YES
Terminal Finish: TIN LEAD SILVER
No. of Terminals: 516
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Screening Level: AEC-Q100
JESD-30 Code: S-PBGA-B516
Package Shape: SQUARE
ROM Words: 3145728
Terminal Form: BALL
Maximum Operating Temperature: 125 Cel
Package Code: BGA
Moisture Sensitivity Level (MSL): 3
Speed: 200 rpm
RAM Bytes: 196608
Bit Size: 32
JESD-609 Code: e0
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA516,26X26,40
Peak Reflow Temperature (C): 245
ROM Programmability: FLASH
Terminal Pitch: 1 mm
Temperature Grade: AUTOMOTIVE
Power Supplies (V): 1.2,3.3,5
CPU Family: E200
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