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Manufacturer | NXP Semiconductors |
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Manufacturer's Part Number | SVF311R3K2CKU2 |
Description | MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 176; Package Code: HLFQFP; Package Shape: SQUARE; |
Datasheet | SVF311R3K2CKU2 Datasheet |
In Stock | 2,073 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 1.16 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 1.23 V |
Integrated Cache: | YES |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Maximum Seated Height: | 1.6 mm |
Surface Mount: | YES |
Terminal Finish: | TIN |
No. of Terminals: | 176 |
Terminal Position: | QUAD |
Format: | FLOATING POINT |
Package Style (Meter): | FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
Address Bus Width: | 0 |
Technology: | CMOS |
JESD-30 Code: | S-PQFP-G176 |
Package Shape: | SQUARE |
Terminal Form: | GULL WING |
Maximum Operating Temperature: | 85 Cel |
Package Code: | HLFQFP |
Width: | 24 mm |
Moisture Sensitivity Level (MSL): | 3 |
Speed: | 266 rpm |
Peripheral IC Type: | MICROPROCESSOR, RISC |
Maximum Supply Voltage: | 1.26 V |
Low Power Mode: | YES |
Boundary Scan: | YES |
External Data Bus Width: | 0 |
JESD-609 Code: | e3 |
Minimum Operating Temperature: | -40 Cel |
Length: | 24 mm |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | .5 mm |
Temperature Grade: | INDUSTRIAL |