NXP Semiconductors - T1024NXE7MQA

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T1024NXE7MQA by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number T1024NXE7MQA
Description SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: HFBGA; Package Shape: SQUARE;
Datasheet T1024NXE7MQA Datasheet
In Stock545
NAME DESCRIPTION
Minimum Supply Voltage: .97 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1 V
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 2.07 mm
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 780
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG, FINE PITCH
Technology: CMOS
JESD-30 Code: S-PBGA-B780
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 105 Cel
Package Code: HFBGA
Width: 23 mm
Moisture Sensitivity Level (MSL): 3
Peripheral IC Type: SoC
Maximum Supply Voltage: 1.03 V
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
Package Equivalence Code: BGA780,28X28,32
Length: 23 mm
Peak Reflow Temperature (C): 250
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
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Pricing (USD)

Qty. Unit Price Ext. Price
545 $99.670 $54,320.150

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