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Manufacturer | NXP Semiconductors |
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Manufacturer's Part Number | T2080NXN8MQB |
Description | MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 896; Package Code: FBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY; |
Datasheet | T2080NXN8MQB Datasheet |
In Stock | 662 |
NAME | DESCRIPTION |
---|---|
Minimum Supply Voltage: | .995 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 1.025 V |
Integrated Cache: | YES |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Seated Height: | 2.61 mm |
Surface Mount: | YES |
No. of Terminals: | 896 |
No. of Serial I/Os: | 8 |
Terminal Position: | BOTTOM |
Format: | FIXED POINT |
Package Style (Meter): | GRID ARRAY, FINE PITCH |
Address Bus Width: | 16 |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B896 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 105 Cel |
Package Code: | FBGA |
Width: | 25 mm |
Moisture Sensitivity Level (MSL): | 3 |
Speed: | 1200 rpm |
Peripheral IC Type: | MICROPROCESSOR, RISC |
Maximum Supply Voltage: | 1.055 V |
No. of External Interrupts: | 12 |
Low Power Mode: | NO |
Boundary Scan: | YES |
External Data Bus Width: | 64 |
Bit Size: | 64 |
Minimum Operating Temperature: | -40 Cel |
Package Equivalence Code: | BGA896,30X30,32 |
Length: | 25 mm |
Peak Reflow Temperature (C): | 250 |
Terminal Pitch: | .8 mm |