Image shown is a representation only.
| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | TDA8002CGB-T |
| Description | MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: LFQFP; Package Shape: SQUARE; |
| Datasheet | TDA8002CGB-T Datasheet |
| In Stock | 1,661 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 3 V |
| Package Body Material: | PLASTIC/EPOXY |
| Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
| Nominal Supply Voltage: | 3.3 V |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Maximum Supply Voltage: | 6.5 V |
| Maximum Seated Height: | 1.6 mm |
| Surface Mount: | YES |
| Minimum Operating Temperature: | -25 Cel |
| No. of Terminals: | 32 |
| Qualification: | Not Qualified |
| Terminal Position: | QUAD |
| Package Style (Meter): | FLATPACK, LOW PROFILE, FINE PITCH |
| Length: | 5 mm |
| Technology: | CMOS |
| JESD-30 Code: | S-PQFP-G32 |
| Package Shape: | SQUARE |
| Terminal Form: | GULL WING |
| Maximum Operating Temperature: | 85 Cel |
| Peak Reflow Temperature (C): | 260 |
| Package Code: | LFQFP |
| Width: | 5 mm |
| Terminal Pitch: | .5 mm |
| Temperature Grade: | OTHER |
