NXP Semiconductors - TDA8026ET/C2,518

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TDA8026ET/C2,518 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number TDA8026ET/C2,518
Description MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 64; Package Code: FBGA; Package Shape: SQUARE;
Datasheet TDA8026ET/C2,518 Datasheet
In Stock2,178
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Maximum Time At Peak Reflow Temperature (s): 30
Sub-Category: Other Microprocessor ICs
Surface Mount: YES
Maximum Supply Current: 260 mA
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 64
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
JESD-30 Code: S-PBGA-B64
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: FBGA
Moisture Sensitivity Level (MSL): 2
Peripheral IC Type: MICROPROCESSOR CIRCUIT
JESD-609 Code: e1
Minimum Operating Temperature: -25 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA64,8X8,32
Peak Reflow Temperature (C): 260
Terminal Pitch: .8 mm
Temperature Grade: OTHER
Power Supplies (V): 3.3
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Pricing (USD)

Qty. Unit Price Ext. Price
2,178 $3.220 $7,013.160

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