NXP Semiconductors - TDA8350Q

TDA8350Q by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number TDA8350Q
Description VERTICAL DEFLECTION IC; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: THROUGH-HOLE; No. of Terminals: 13; Package Code: ZIP; Package Shape: RECTANGULAR;
Datasheet TDA8350Q Datasheet
In Stock3,053
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Blanking Output: YES
Maximum Seated Height: 17 mm
Minimum Supply Voltage (Vsup): 9 V
Sub-Category: Deflection ICs
Surface Mount: NO
Terminal Finish: MATTE TIN
No. of Terminals: 13
Terminal Position: ZIG-ZAG
Package Style (Meter): IN-LINE
Technology: BIPOLAR
JESD-30 Code: R-PZIP-T13
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Maximum Operating Temperature: 75 Cel
Package Code: ZIP
General IC Type: VERTICAL DEFLECTION IC
Width: 4.5 mm
JESD-609 Code: e3
Minimum Operating Temperature: -25 Cel
No. of Functions: 1
Qualification: Not Qualified
Package Equivalence Code: ZIP13,.2,.2,67
Length: 23.8 mm
Terminal Pitch: 1.7 mm
Temperature Grade: COMMERCIAL EXTENDED
Maximum Supply Voltage (Vsup): 25 V
Power Supplies (V): 16
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Pricing (USD)

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