NXP Semiconductors - TDA8357J

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TDA8357J by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number TDA8357J
Description VERTICAL DEFLECTION IC; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 9; Package Code: ZIP; Package Shape: RECTANGULAR;
Datasheet TDA8357J Datasheet
In Stock1,495
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Blanking Output: NO
Maximum Seated Height: 21.4 mm
Minimum Supply Voltage (Vsup): 7.5 V
Sub-Category: Deflection ICs
Surface Mount: NO
Terminal Finish: MATTE TIN
No. of Terminals: 9
Terminal Position: ZIG-ZAG
Package Style (Meter): IN-LINE
Technology: BCDMOS
JESD-30 Code: R-PZIP-T9
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Maximum Operating Temperature: 85 Cel
Package Code: ZIP
General IC Type: VERTICAL DEFLECTION IC
Width: 2.5 mm
JESD-609 Code: e3
Minimum Operating Temperature: -25 Cel
No. of Functions: 1
Qualification: Not Qualified
Package Equivalence Code: ZIP9,.2
Length: 13 mm
Terminal Pitch: 1.27 mm
Temperature Grade: OTHER
Maximum Supply Voltage (Vsup): 18 V
Power Supplies (V): 12
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Pricing (USD)

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