TEA1065 by NXP Semiconductors | Telecommunications

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	TEA1065
Description	TELEPHONE SPEECH CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: THROUGH-HOLE; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR;
Datasheet	TEA1065 Datasheet
In Stock	1,409

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Telecom IC Type:	TELEPHONE SPEECH CIRCUIT
Maximum Seated Height:	5.1 mm
Sub-Category:	Telephone Circuits
Surface Mount:	NO
Minimum Operating Temperature:	-25 Cel
No. of Functions:	1
No. of Terminals:	24
Qualification:	Not Qualified
Package Equivalence Code:	DIP24,.6
Terminal Position:	DUAL
Package Style (Meter):	IN-LINE
Length:	31.7 mm
Technology:	BIPOLAR
JESD-30 Code:	R-PDIP-T24
Package Shape:	RECTANGULAR
Terminal Form:	THROUGH-HOLE
Maximum Operating Temperature:	75 Cel
Package Code:	DIP
Width:	15.24 mm
Terminal Pitch:	2.54 mm
Temperature Grade:	COMMERCIAL EXTENDED

Pricing (USD)

Qty.	Unit Price	Ext. Price
1,409	-	-

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