TEA1069H-T by NXP Semiconductors | Telecommunications

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	TEA1069H-T
Description	TELEPHONE MULTIFUNCTION CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 44; Package Code: QFP; Package Shape: SQUARE;
Datasheet	TEA1069H-T Datasheet
In Stock	787

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	2.7 V
Telecom IC Type:	TELEPHONE MULTIFUNCTION CIRCUIT
Maximum Seated Height:	2.1 mm
Surface Mount:	YES
Terminal Finish:	TIN
JESD-609 Code:	e3
Minimum Operating Temperature:	-25 Cel
Make-break Ratio:	2:1
No. of Functions:	1
No. of Terminals:	44
Qualification:	Not Qualified
Terminal Position:	QUAD
Package Style (Meter):	FLATPACK
Length:	10 mm
JESD-30 Code:	S-PQFP-G44
Package Shape:	SQUARE
Terminal Form:	GULL WING
Additional Features:	3:2 MAKE/BREAK RATIO IF OPTION DIODE PRESENT
Maximum Operating Temperature:	75 Cel
Package Code:	QFP
Width:	10 mm
Terminal Pitch:	.8 mm
Temperature Grade:	COMMERCIAL EXTENDED

Pricing (USD)

Qty.	Unit Price	Ext. Price
787	-	-

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