NXP Semiconductors - XCB56364FU100

XCB56364FU100 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number XCB56364FU100
Description DIGITAL SIGNAL PROCESSOR, OTHER; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;
Datasheet XCB56364FU100 Datasheet
In Stock988
NAME DESCRIPTION
Minimum Supply Voltage: 3.14 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Maximum Seated Height: 1.7 mm
Sub-Category: Digital Signal Processors
Surface Mount: YES
Maximum Supply Current: 181 mA
No. of Terminals: 100
Terminal Position: QUAD
Format: FIXED POINT
Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH
Address Bus Width: 18
Technology: CMOS
RAM Words: 2560
JESD-30 Code: S-PQFP-G100
Maximum Clock Frequency: 100 MHz
Package Shape: SQUARE
Terminal Form: GULL WING
Maximum Operating Temperature: 105 Cel
Package Code: LFQFP
Width: 14 mm
Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER
Maximum Supply Voltage: 3.46 V
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 8
Bit Size: 24
Barrel Shifter: YES
Minimum Operating Temperature: 0 Cel
Internal Bus Architecture: MULTIPLE
Qualification: Not Qualified
Package Equivalence Code: QFP100,.63SQ,20
Length: 14 mm
Terminal Pitch: .5 mm
Temperature Grade: OTHER
Power Supplies (V): 3.3
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