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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | XPC7445RX800LC |
| Description | MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 360; Package Code: BGA; Package Shape: SQUARE; |
| Datasheet | XPC7445RX800LC Datasheet |
| In Stock | 1,706 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 1.55 V |
| Package Body Material: | CERAMIC, METAL-SEALED COFIRED |
| Nominal Supply Voltage: | 1.6 V |
| Integrated Cache: | YES |
| Maximum Seated Height: | 3.2 mm |
| Surface Mount: | YES |
| No. of Terminals: | 360 |
| Terminal Position: | BOTTOM |
| Format: | FLOATING POINT |
| Package Style (Meter): | GRID ARRAY |
| Address Bus Width: | 36 |
| Technology: | CMOS |
| JESD-30 Code: | S-CBGA-B360 |
| Maximum Clock Frequency: | 133 MHz |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 105 Cel |
| Package Code: | BGA |
| Width: | 25 mm |
| Speed: | 800 rpm |
| Peripheral IC Type: | MICROPROCESSOR, RISC |
| Maximum Supply Voltage: | 1.65 V |
| Low Power Mode: | YES |
| Boundary Scan: | YES |
| External Data Bus Width: | 64 |
| Bit Size: | 32 |
| Minimum Operating Temperature: | 0 Cel |
| Package Equivalence Code: | BGA360,19X19,50 |
| Length: | 25 mm |
| Terminal Pitch: | 1.27 mm |
| Temperature Grade: | OTHER |
