NXP Semiconductors - XPC7450RX600LD

XPC7450RX600LD by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number XPC7450RX600LD
Description MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
Datasheet XPC7450RX600LD Datasheet
In Stock556
NAME DESCRIPTION
Package Body Material: CERAMIC
Speed: 600 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Nominal Supply Voltage: 1.8 V
Sub-Category: Microprocessors
Surface Mount: YES
Bit Size: 32
Minimum Operating Temperature: 0 Cel
No. of Terminals: 484
Qualification: Not Qualified
Package Equivalence Code: BGA484,22X22,50
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: S-XBGA-B484
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 105 Cel
Package Code: BGA
Terminal Pitch: 1.27 mm
Temperature Grade: OTHER
Power Supplies (V): 1.8
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