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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | XPC8245TZU350B |
| Description | MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; Package Code: BGA; Package Shape: RECTANGULAR; Nominal Supply Voltage: 2 V; |
| Datasheet | XPC8245TZU350B Datasheet |
| In Stock | 556 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 1.9 V |
| Package Body Material: | PLASTIC/EPOXY |
| Speed: | 350 rpm |
| Peripheral IC Type: | MICROPROCESSOR |
| Nominal Supply Voltage: | 2 V |
| Integrated Cache: | NO |
| Maximum Supply Voltage: | 2.1 V |
| Low Power Mode: | NO |
| Boundary Scan: | NO |
| Surface Mount: | YES |
| Minimum Operating Temperature: | -40 Cel |
| Terminal Position: | BOTTOM |
| Format: | FIXED POINT |
| Package Style (Meter): | GRID ARRAY |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 105 Cel |
| Package Code: | BGA |
| Temperature Grade: | INDUSTRIAL |







