NXP Semiconductors - XPC850DECZT66BU

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XPC850DECZT66BU by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number XPC850DECZT66BU
Description MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B256;
Datasheet XPC850DECZT66BU Datasheet
In Stock265
NAME DESCRIPTION
Minimum Supply Voltage: 3.135 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Integrated Cache: YES
Maximum Seated Height: 2.35 mm
Surface Mount: YES
No. of Terminals: 256
Terminal Position: BOTTOM
Format: FIXED POINT
Package Style (Meter): GRID ARRAY
Address Bus Width: 26
Technology: CMOS
JESD-30 Code: S-PBGA-B256
Package Shape: SQUARE
Terminal Form: BALL
Package Code: BGA
Width: 23 mm
Speed: 66 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Maximum Supply Voltage: 3.465 V
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 32
Bit Size: 32
Length: 23 mm
Terminal Pitch: 1.27 mm
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