NXP Semiconductors - XPC857TCZP50B

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XPC857TCZP50B by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number XPC857TCZP50B
Description Other uPs/uCs/Peripheral ICs; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Qualification: Not Qualified;
In Stock3,020
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Sub-Category: Other Microprocessor ICs
Surface Mount: YES
Minimum Operating Temperature: 0 Cel
No. of Terminals: 357
Qualification: Not Qualified
Package Equivalence Code: BGA357,19X19,50
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
JESD-30 Code: S-PBGA-B357
Package Shape: SQUARE
Terminal Form: BALL
Package Code: BGA
Terminal Pitch: 1.27 mm
Power Supplies (V): 3.3
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