Omron - PYF14A-E

  1. Home
  2. Omron - PYF14A-E
PYF14A-E by Omron

Image shown is a representation only.

Manufacturer Omron
Manufacturer's Part Number PYF14A-E
Description RELAY SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED; No. of Contacts: 4;
Datasheet PYF14A-E Datasheet
NAME DESCRIPTION
IC Socket Type: Relay Socket
No. of Contacts: 4
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products

HLT-1910-T-R by Samtec

HLT-1910-T-R

Samtec

The Samtec HLT-1910-T-R is a plastic IC socket with 190 brass contacts, featuring Tin over Nickel mating finish. Designed for PGA190 devices, it offers reliable connectivity and durability in chip carrier applications. Ideal for high-performance electronic systems requiring secure component sockets.
134-10-328-00-050000 by Mill-max Mfg

134-10-328-00-050000

Mill-max Mfg

The Mill-max Mfg 134-10-328-00-050000 is a plastic chip carrier IC socket with 28 gold over nickel contacts. It is designed for use on DIP28 devices and has a rectangular contact configuration. Ideal for electronic applications requiring reliable connections.
XR2A-1811-N by Omron

XR2A-1811-N

Omron

IC SOCKET; JESD-609 Code: e4; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): GOLD; Contact Material: NOT SPECIFIED;
360-90-142-00-001000 by Mill-max Mfg

360-90-142-00-001000

Mill-max Mfg

The Mill-max Mfg 360-90-142-00-001000 is a Chip Carrier IC & Component Socket made of POLYETHYLENE, designed for SIP42 devices with 42 contacts. It features TIN LEAD (200) mating finish over NICKEL (150), and Tin/Lead (Sn/Pb) termination with Nickel (Ni) barrier. Ideal for IC SOCKET applications due to its RECTANGLE contact configuration.
D01-9922046 by Harwin Plc

D01-9922046

Harwin Plc

IC SOCKET; Device Type Used On: SIP20; Housing Material: POLYAMIDE46; No. of Contacts: 20; Contact Material: NOT APPLICABLE; Additional Features: 94V-0;
HLS-1820-T-22 by Samtec

HLS-1820-T-22

Samtec

The Samtec HLS-1820-T-22 is a plastic IC socket with 360 gold contacts for PGA360 devices. It offers gold contact finish for mating and termination, suitable for chip carrier applications. This component is designed to provide reliable connections in electronic assemblies.
XR2P-2041 by Omron

XR2P-2041

Omron

IC SOCKET; Contact Material: BERYLLIUM COPPER; Contact Finish (Termination): GOLD; Manufacturer Series: XR2P; JESD-609 Code: e4; Contact Finish (Mating): GOLD (10);
XR2A-4021-N by Omron

XR2A-4021-N

Omron

IC SOCKET; Contact Material: BERYLLIUM COPPER; Manufacturer Series: XR2A; Contact Finish (Mating): GOLD FLASH; Contact Finish (Termination): GOLD FLASH; JESD-609 Code: e4;
P2R-05A by Omron

P2R-05A

Omron

RELAY SOCKET; Contact Finish (Termination): NOT APPLICABLE; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED;
XR2A-1421-N by Omron

XR2A-1421-N

Omron

IC SOCKET; Contact Finish (Mating): GOLD FLASH; JESD-609 Code: e4; Contact Finish (Termination): GOLD FLASH; Manufacturer Series: XR2A; Contact Material: BERYLLIUM COPPER;
551-10-081-09-000004 by Mill-max Mfg

551-10-081-09-000004

Mill-max Mfg

Mill-max Mfg's 551-10-081-09-000004 is a chip carrier IC & component socket made of POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER. It has 81 contacts with GOLD (10) over NICKEL (150) mating finish and Gold (Au) termination finish. This IC socket is used on PGA81 devices.
326-93-105-41-001000 by Mill-max Mfg

326-93-105-41-001000

Mill-max Mfg

Mill-max Mfg's 326-93-105-41-001000 is a PLASTIC IC SOCKET for SIP5 devices with 5 BERYLLIUM COPPER contacts. It features Tin/Lead finish and RECTANGLE contact configuration, ideal for Chip Carrier IC applications.
ICF-624-T-O-TR by Samtec

ICF-624-T-O-TR

Samtec

Samtec's ICF-624-T-O-TR is a Chip Carrier IC Socket with 24 contacts, Beryllium Copper material, and Matte Tin finish. It has a 15.24mm PCB contact row spacing and operates b/w -55°C to 125°C. Ideal for DIP24 devices, it features a rectangular contact pattern for surface mount termination in electronic applications.
M12883/48-01 by Amphenol

M12883/48-01

Amphenol

Amphenol's M12883/48-01 is a POLYETHERIMIDE chip carrier socket with 11 GOLD contacts for RELAY devices. Ideal for relay sockets, it offers reliable connection and durability in electronic applications.
110-87-624-41-001101 by Preci-dip Sa

110-87-624-41-001101

Preci-dip Sa

110-87-624-41-001101 by Preci-dip Sa is a DIP24 IC socket with 24 contacts, rated for 1A current. It features Beryllium Copper contact material with Gold Flash finish and Polycyclohexydimethylene Terephthalate-Polyester housing. With a PCB contact row spacing of 15.24mm, it operates b/w -55°C to 125°C, making it ideal for various electronic applications.
XR2D-1601-N by Omron

XR2D-1601-N

Omron

IC SOCKET; JESD-609 Code: e4; Contact Finish (Mating): GOLD (30); Contact Finish (Termination): Gold (Au); Contact Material: BERYLLIUM COPPER;
2271015 by Phoenix Contact

2271015

Phoenix Contact

RELAY SOCKET; Device Type Used On: SIP1; Housing Material: POLYAMIDE; No. of Contacts: 1; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
XR2A-2221-N by Omron

XR2A-2221-N

Omron

IC SOCKET; JESD-609 Code: e4; Contact Finish (Termination): GOLD FLASH; Manufacturer Series: XR2A; Contact Finish (Mating): GOLD FLASH; Contact Material: BERYLLIUM COPPER;
828-AG12D-ES-LF by TE Connectivity

828-AG12D-ES-LF

TE Connectivity

TE Connectivity's 828-AG12D-ES-LF is a chip carrier IC socket with 28 contacts and a rectangular PCB contact pattern. It has a body length of 1.4 inch, body width of 0.7 inch, and body depth of 0.18 inch. This socket is commonly used on DIP28 devices and can withstand temperatures ranging from -55 to 105 °C.
510-93-168-17-101001 by Mill-max Mfg

510-93-168-17-101001

Mill-max Mfg

IC SOCKET; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): NOT SPECIFIED;