Tyco Electronics Amp - 2-1571552-2

  1. Home
  2. Tyco Electronics Amp - 2-1571552-2
2-1571552-2 by Tyco Electronics Amp

Image shown is a representation only.

Manufacturer Tyco Electronics Amp
Manufacturer's Part Number 2-1571552-2
Description IC SOCKET; Device Type Used On: DIP8; Housing Material: PCT PLASTIC POLYESTER; Contact Finish (Termination): TIN OVER NICKEL; Contact Finish (Mating): GOLD FLASH OVER NICKEL (100); JESD-609 Code: e3;
Datasheet 2-1571552-2 Datasheet
NAME DESCRIPTION
Contact Finish (Mating): Gold Flash over Nickel (100)
IC Socket Type: IC Socket
Contact Finish (Termination): Tin over Nickel
Housing Material: Polycyclohexylene Dimethylene Terephthalate (PCT)
Device Type Used On: DIP8
Contact Material: Beryllium Copper
Manufacturer Series: 1571552
JESD-609 Code: e3
No. of Contacts: 8
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products

115-47-632-41-001000 by Mill-max Mfg

115-47-632-41-001000

Mill-max Mfg

IC SOCKET; Contact Finish (Mating): NOT SPECIFIED; JESD-609 Code: e3; Contact Finish (Termination): TIN; Contact Material: NOT SPECIFIED;
304-13-104-41-780000 by Mill-max Mfg

304-13-104-41-780000

Mill-max Mfg

Mill-max Mfg's 304-13-104-41-780000 is a POLYETHYLENE IC SOCKET for SIP4 devices with 4 GOLD OVER NICKEL contacts. Ideal for Chip Carrier IC & Component Sockets, featuring RECTANGLE contact configuration.
342-40-156-00-593000 by Mill-max Mfg

342-40-156-00-593000

Mill-max Mfg

Mill-max Mfg's 342-40-156-00-593000 is a POLYETHYLENE IC SOCKET for SIP56 devices with 56 contacts. It features MATTE TIN OVER NICKEL finish, RECTANGLE contact config, ideal for Chip Carrier IC & Component Sockets applications.
XR2A-4215 by Omron

XR2A-4215

Omron

IC SOCKET; Manufacturer Series: XR2;
XR2D-2404 by Omron

XR2D-2404

Omron

IC SOCKET; Contact Finish (Termination): Gold (Au); JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): GOLD (30);
69802-432LF by Amphenol Communications Solutions

69802-432LF

Amphenol Communications Solutions

Amphenol's 69802-432LF is a PLCC32 IC socket with POLYPHENYLENE SULFIDE housing. Featuring 32 contacts, it has a current rating of 1A and operates b/w -55°C to 125°C. With surface mount termination and high insulation resistance, it is ideal for chip carrier applications.
134-10-328-00-050000 by Mill-max Mfg

134-10-328-00-050000

Mill-max Mfg

The Mill-max Mfg 134-10-328-00-050000 is a plastic chip carrier IC socket with 28 gold over nickel contacts. It is designed for use on DIP28 devices and has a rectangular contact configuration. Ideal for electronic applications requiring reliable connections.
410-83-220-10-001101 by Preci-dip Sa

410-83-220-10-001101

Preci-dip Sa

410-83-220-10-001101 by Preci-dip Sa is a chip carrier IC & component socket with a GLASS FILLED POLYESTER housing material. It is used on DIP20 devices and has a min operating temperature of -55°C. With 20 contacts, it has an insulation resistance of 10^10 ohm and can handle a current rating of 1A.
5-1437536-2 by TE Connectivity

5-1437536-2

TE Connectivity

TE Connectivity 5-1437536-2 is a DIP28 IC socket with 28 contacts. It features a PCB contact row spacing of 15.24mm, rectangular contact pattern, and polyester housing material. Suitable for applications requiring a current rating of 3A, it has solder termination and operates b/w -55°C to 125°C.
210-93-308-41-001000 by Mill-max Mfg

210-93-308-41-001000

Mill-max Mfg

210-93-308-41-001000 by Mill-max Mfg is a Chip Carrier IC Socket with PCT Polyester housing and Beryllium Copper contacts. It is designed for DIP8 devices, featuring 8 contacts with Tin/Lead finish. Ideal for applications requiring reliable connection in electronic circuits.
1-1393824-0 by TE Connectivity

1-1393824-0

TE Connectivity

IC SOCKET; Housing Material: POLYCARBONATE; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE; Termination Type: SOLDER;
P2RFZ-08-E by Omron

P2RFZ-08-E

Omron

Omron P2RFZ-08-E is a RELAY SOCKET with 8 contacts, 5A current rating, and screw termination. It has staggered contact configuration and straight mounting style. Ideal for applications requiring high insulation resistance of 1GΩ.
818-22-012-10-001101 by Mill-max Mfg

818-22-012-10-001101

Mill-max Mfg

IC SOCKET; Device Type Used On: DIP12; Housing Material: PLASTIC; Contact Material: NOT SPECIFIED; No. of Contacts: 12; Contact Finish (Termination): GOLD OVER NICKEL;
PY14QN-Y3 by Omron

PY14QN-Y3

Omron

RELAY SOCKET;
228-1371-00-0602J by 3m Electronic Products Division

228-1371-00-0602J

3m Electronic Products Division

The 3M Electronic Products Division's 228-1371-00-0602J is a DIP28 IC socket with GLASS FILLED POLYSULFONE housing and BERYLLIUM COPPER contacts. It features 28 gold-plated contacts for reliable connections. Ideal for chip carrier ICs, this socket ensures secure component mounting in electronic devices.
A40-LC-TT by Assmann Wsw Components

A40-LC-TT

Assmann Wsw Components

A40-LC-TT by Assmann Wsw Components is a DIP40 IC socket with 40 phosphor bronze contacts and polybutylene terephthalate housing. Contacts have tin finish (80) for mating and termination. Ideal for chip carrier ICs, this rectangular contact configuration ensures secure connections in electronic applications.
27E487 by TE Connectivity

27E487

TE Connectivity

TE Connectivity's 27E487 is an IC SOCKET with GLASS FILLED POLYESTER housing. It features 8 RND PIN-SKT contacts terminated by SCREW, designed for RELAY applications.
V23333-Z0002-A041 by TE Connectivity

V23333-Z0002-A041

TE Connectivity

IC SOCKET; Termination Type: SOLDER; No. of Contacts: 5; Contact Finish (Mating): NOT SPECIFIED;
8134-HC-5P3 by TE Connectivity

8134-HC-5P3

TE Connectivity

TE Connectivity's 8134-HC-5P3 is a Chip Carrier IC Socket with -65 to 125°C temp range, PRESS FIT termination, and 5A current rating. Ideal for straight mounting applications in electronic devices requiring reliable IC connections.
110-024-050 by 3m Electronic Products Division

110-024-050

3m Electronic Products Division

The 3M Electronic Products Division's 110-024-050 is a DIP24 IC socket with GLASS FILLED POLYPHENYLENE SULFIDE housing and BERYLLIUM COPPER contacts. It features 24 gold-plated contacts for reliable connections, suitable for chip carrier IC applications.