Samtec - HLT-1712-G-T

  1. Home
  2. Samtec - HLT-1712-G-T
HLT-1712-G-T by Samtec

Image shown is a representation only.

Manufacturer Samtec
Manufacturer's Part Number HLT-1712-G-T
Description IC SOCKET; Device Type Used On: PGA204; Housing Material: PLASTIC; JESD-609 Code: e4; Contact Material: BRASS; Contact Finish (Mating): GOLD (20) OVER NICKEL (50);
Datasheet HLT-1712-G-T Datasheet
NAME DESCRIPTION
Contact Finish (Mating): Gold (20) over Nickel (50)
IC Socket Type: IC Socket
Contact Finish (Termination): Gold with Nickel Barrier
Housing Material: Plastic
Device Type Used On: PGA204
Contact Material: Brass
JESD-609 Code: e4
No. of Contacts: 204
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products

8PFA by Omron

8PFA

Omron

RELAY SOCKET; Contact Finish (Termination): NOT APPLICABLE; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
8444-21B1-RK-TR by 3m Electronic Products Division

8444-21B1-RK-TR

3m Electronic Products Division

IC SOCKET; Housing Material: GLASS FILLED POLYPHENYLENE SULFIDE; Contact Material: PHOSPHOR BRONZE; Contact Finish (Mating): MATTE TIN (160) OVER NICKEL (50); Additional Features: STANDARD: UL 94V-0; No. of Contacts: 44;
SS-104-TT-2-N by Samtec

SS-104-TT-2-N

Samtec

SS-104-TT-2-N by Samtec is a Chip Carrier IC Socket with 4 contacts, BE-CU contact material, and SN mating finish. It has a rectangular PCB contact pattern and glass-filled polyester housing. Ideal for SIP4 devices, it operates b/w -65°C to 125°C, making it suitable for various electronic applications.
CQF208-168B by Texas Instruments

CQF208-168B

Texas Instruments

IC SOCKET; Device Type Used On: QFP208; Housing Material: GLASS FILLED POLYETHERIMIDE; Manufacturer Series: CQF; No. of Contacts: 208;
110-99-632-41-001000 by Mill-max Mfg

110-99-632-41-001000

Mill-max Mfg

Mill-max Mfg's 110-99-632-41-001000 is a Chip Carrier IC Socket with POLYETHYLENE housing, BERYLLIUM COPPER contacts, and 32 rectangular contacts. It is designed for DIP32 devices and features Tin/Lead finish with Nickel barrier. Ideal for electronic applications requiring reliable connections in integrated circuits.
RSE120159 by Amphenol

RSE120159

Amphenol

RELAY SOCKET; Housing Material: POLYETHERIMIDE; JESD-609 Code: e4; Contact Finish (Mating): GOLD; Contact Finish (Termination): GOLD; Additional Features: LOW PROFILE;
27000000 by TE Connectivity

27000000

TE Connectivity

RELAY SOCKET; JESD-609 Code: e3; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT APPLICABLE; Contact Finish (Termination): TIN;
114-87-316-41-117101 by Preci-dip Sa

114-87-316-41-117101

Preci-dip Sa

IC SOCKET; Device Type Used On: DIP16; Housing Material: PCT POLYESTER; No. of Contacts: 16; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
173-10-328-00-001000 by Mill-max Mfg

173-10-328-00-001000

Mill-max Mfg

The Mill-max Mfg 173-10-328-00-001000 is a plastic chip carrier IC socket with 28 gold over nickel contacts. It is designed for use on DIP28 devices and has a rectangular contact configuration. Ideal for electronic applications requiring reliable connections.
XR2B-4011-N by Omron

XR2B-4011-N

Omron

IC SOCKET; Contact Material: BERYLLIUM COPPER; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD (10); JESD-609 Code: e4; Manufacturer Series: XR2;
415-13-228-41-003000 by Mill-max Mfg

415-13-228-41-003000

Mill-max Mfg

The Mill-max Mfg 415-13-228-41-003000 is a POLYETHYLENE IC SOCKET for SIP28 devices with 28 contacts. It features GOLD OVER NICKEL contact finish, RECTANGLE contact config, and is ideal for Chip Carrier IC & Component Sockets applications.
1-1437539-7 by TE Connectivity

1-1437539-7

TE Connectivity

TE Connectivity 1-1437539-7 is a DIP14 IC SOCKET with 14 contacts, rated at 3A current. It has a PCB contact row spacing of 7.49mm and uses solder termination. This chip carrier socket is commonly used in applications requiring a mating contact pitch of 0.1 inch and operates within -55 to 105°C temperature range.
ICF-316-T-O-TR by Samtec

ICF-316-T-O-TR

Samtec

Samtec's ICF-316-T-O-TR is a chip carrier socket with 16 contacts, rectangular pattern, and liquid crystal polymer housing. It has a contact pitch of 0.1", suitable for DIP16 devices. With operating temperatures from -55°C to 125°C, it is ideal for surface mount applications in electronics.
27E487 by TE Connectivity

27E487

TE Connectivity

TE Connectivity's 27E487 is an IC SOCKET with GLASS FILLED POLYESTER housing. It features 8 RND PIN-SKT contacts terminated by SCREW, designed for RELAY applications.
VCF4-1002 by TE Connectivity

VCF4-1002

TE Connectivity

IC SOCKET; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE; Termination Type: SOLDER;
173-10-314-00-001000 by Mill-max Mfg

173-10-314-00-001000

Mill-max Mfg

Mill-max Mfg's 173-10-314-00-001000 is a plastic chip carrier IC socket with 14 gold over nickel contacts. It is used for DIP14 devices and has a rectangular contact configuration.
614-87-964-31-012101 by Preci-dip Sa

614-87-964-31-012101

Preci-dip Sa

614-87-964-31-012101 by Preci-dip Sa is a DIP64 IC socket with 64 contacts. It features Beryllium Copper contact material with Gold Flash mating finish and Tin termination. The housing material is PCT Polyester, making it ideal for use in chip carrier applications.
M12883/52-001 by Amphenol

M12883/52-001

Amphenol

RELAY SOCKET; Housing Material: POLYETHERIMIDE; Additional Features: LOW PROFILE; Contact Finish (Termination): GOLD; JESD-609 Code: e4; Contact Finish (Mating): GOLD;
PL15 by Omron

PL15

Omron

RELAY SOCKET; Contact Finish (Termination): NOT APPLICABLE; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED;
27E122 by TE Connectivity

27E122

TE Connectivity

TE Connectivity's 27E122 is a Chip Carrier IC Socket with GLASS FILLED POLYESTER housing. It features 8 RND PIN-SKT contacts and SCREW termination, suitable for RELAY devices. With dimensions of 2.385" x 1.296" x 0.925", it is ideal for IC SOCKET applications.