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| Manufacturer | Onsemi |
|---|---|
| Manufacturer's Part Number | FSA553UCX |
| Description | SPST; Temperature Grade: INDUSTRIAL; No. of Terminals: 9; Package Code: VFBGA; Package Shape: RECTANGULAR; Surface Mount: YES; |
| Datasheet | FSA553UCX Datasheet |
| In Stock | 3,373 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Width (mm): | 1.21 mm |
| Maximum Seated Height: | .619 mm |
| Minimum Supply Voltage (Vsup): | 0 V |
| Nominal On-state Resistance Match: | .01 ohm |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER |
| No. of Terminals: | 9 |
| Maximum On-state Resistance (Ron): | .8 ohm |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| JESD-30 Code: | R-PBGA-B9 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| No. of Channels: | 2 |
| Package Code: | VFBGA |
| Moisture Sensitivity Level (MSL): | 1 |
| Nominal Off-state Isolation: | 82 dB |
| Normal Position (V): | NC |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| Package Equivalence Code: | BGA9,3X3,16 |
| Other IC type: | SPST |
| Length: | 1.38 mm |
| Output (V): | SEPARATE OUTPUT |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .4 mm |
| Temperature Grade: | INDUSTRIAL |
| Maximum Supply Voltage (Vsup): | 3 V |
