Onsemi - SA3291A-E1-T

AM5718AABCX by Texas Instruments is a 760-terminal System on Chip with CMOS technology. It operates b/w 0-90°C, with supply voltage ranging from 1.11-1.2V. Ideal for applications requiring high-speed processing in compact spaces.

OMAPL138EZWTA3 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 50 MHz Max Clock Frequency. It operates in an INDUSTRIAL temperature grade range of -40 to 105 °C, making it suitable for applications requiring high-speed processing in harsh environments. With I2C, SPI, UART, and USB bus compatibility, this device is ideal for various embedded systems and industrial automation solutions.

XC7Z035-2FFG900E by Xilinx is a programmable system on chip with CMOS technology. It operates b/w 0 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With a grid array package style, it's ideal for various applications in the Other Function uPs,uCs & Peripheral ICs category.

SYSTEM ON CHIP;

AM5716AABCXQ1 by Texas Instruments is a 760-terminal SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 125 °C, suitable for automotive applications. With a supply voltage range of 1.11V to 1.2V, it features a fine pitch grid array package style for surface mount assembly.

AM6232ASGGHAALW by Texas Instruments is a 425-terminal SoC with CMOS technology. It operates b/w -40°C to 105°C, with supply voltage ranging from 0.715V to 0.79V. This IC is ideal for applications requiring a very thin profile and fine pitch grid array package style.

MTFC8GLDEA-4MIT by Micron Technology is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.65V to 1.95V. The package style is GRID ARRAY, very thin profile, fine pitch, making it suitable for industrial applications requiring high performance in compact spaces.

SoC;

The Xilinx XC7Z045-1FBG676C is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05V. With 676 terminals in a square grid array package, it's ideal for various applications requiring high-performance processing capabilities.

MCIMX286CVM4BR2 by NXP Semiconductors is a System on Chip with 289 terminals, operating at -40 to 85°C. It has a supply voltage range of 1.35-1.55V and uses CMOS technology. This low-profile, fine-pitch IC is ideal for industrial applications requiring high performance in a compact form factor.

VS3674UNION by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It features 338 terminals in a GRID ARRAY package style, suitable for applications requiring low profile and fine pitch components. With a supply voltage range of 1.28V to 1.42V and operating temperature from 0°C to 85°C, it offers versatility in various electronic designs.

SoC;

BM83SM1-00AA by Microchip Technology is a 50-terminal IC with max supply voltage of 4.2V and min operating temp of -40°C. Ideal for applications requiring programmable RFSoC technology in compact microelectronic assemblies.

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Moisture Sensitivity Level (MSL): 3; Terminal Finish: PURE TIN;

MCP25020-I/P by Microchip: 8-bit peripheral IC, operates at -40 to 85 °C, with supply voltage of 2.7-5.5 V. Ideal for industrial applications requiring microprocessor circuits in a rectangular package style with dual terminals.

NRF52832-QFAA-R by Nordic Semiconductor Asa is a 48-terminal SoC with CMOS technology. It operates b/w -40 to 85 °C and supports supply voltage range of 1.7V to 3.6V. Ideal for applications requiring low-profile, surface-mount chips in compact devices.

MCIMX6Z0DVM09AB by NXP Semiconductors is a 289-terminal SoC with CMOS technology. It operates b/w 0-95°C, with supply voltage range of 1.375-1.5V. Ideal for applications requiring low profile and fine pitch grid array packages.

SoC; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE; Terminal Pitch: .8 mm;

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE;

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 529; Package Code: FBGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 40;