Phoenix Contact - PR3-BSC1/3X21

  1. Home
  2. Phoenix Contact - PR3-BSC1/3X21
PR3-BSC1/3X21 by Phoenix Contact

Image shown is a representation only.

Manufacturer Phoenix Contact
Manufacturer's Part Number PR3-BSC1/3X21
Description RELAY SOCKET; Device Type Used On: RELAY; Rating (Current): 10 A; Maximum Operating Temperature: 85 Cel; Body Length: 2.95 inch; Body Width: 1.496 inch;
Datasheet PR3-BSC1/3X21 Datasheet
NAME DESCRIPTION
Body Width: 1.496 inch
IC Socket Type: Relay Socket
Termination Type: Screw
Body Length: 2.95 inch
Device Type Used On: RELAY
Maximum Operating Temperature: 85 °C (185 °F)
Rating (Current): 10 A
Minimum Operating Temperature: -40 °C (-40 °F)
No. of Contacts: 11
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products

1-2199300-2 by TE Connectivity

1-2199300-2

TE Connectivity

TE Connectivity 1-2199300-2 is a DIP32 IC SOCKET with 32 contacts, PCB spacing of 15.24mm, and housing made of POLYESTER. It has a current rating of 1A, operates b/w -40 to 105 °C, and uses SOLDER termination. Ideal for applications requiring chip carrier sockets with bellowed contact style.
2-345832-2 by Tyco Electronics Amp

2-345832-2

Tyco Electronics Amp

IC SOCKET; Device Type Used On: DIP20; Manufacturer Series: 345832; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): NOT SPECIFIED; JESD-609 Code: e0;
111-91-964-41-001000 by Mill-max Mfg

111-91-964-41-001000

Mill-max Mfg

Mill-max Mfg's 111-91-964-41-001000 is a Chip Carrier IC Socket with 64 contacts. It features Beryllium Copper contact material, Gold over Nickel mating finish, and Tin/Lead termination. Ideal for DIP64 devices, this socket has a Polyethylene housing and rectangular contact configuration.
2271390 by Phoenix Contact

2271390

Phoenix Contact

RELAY SOCKET; Device Type Used On: SIP8; Housing Material: POLYAMIDE; Contact Material: NOT SPECIFIED; No. of Contacts: 8; Contact Finish (Mating): NOT SPECIFIED;
HLT-1712-T-T by Samtec

HLT-1712-T-T

Samtec

The Samtec HLT-1712-T-T is a plastic IC socket with 204 brass contacts, featuring tin over nickel mating finish. It is designed for use on PGA204 devices and offers reliable connection termination with tin (Sn) and nickel (Ni) barrier. Ideal for chip carrier applications requiring secure component sockets.
XR2H-2811-N by Omron

XR2H-2811-N

Omron

IC SOCKET; Manufacturer Series: XR2;
ZA8-20-2-1.00-Z-10 by Samtec

ZA8-20-2-1.00-Z-10

Samtec

IC SOCKET;
PTF08A-E by Omron

PTF08A-E

Omron

RELAY SOCKET; Device Type Used On: RELAY; Contact Finish (Mating): NOT APPLICABLE; No. of Contacts: 8; Contact Material: NOT APPLICABLE;
350-10-117-00-001000 by Mill-max Mfg

350-10-117-00-001000

Mill-max Mfg

350-10-117-00-001000 by Mill-max Mfg is a PLASTIC IC SOCKET for SIP17 devices with 17 contacts. Features GOLD OVER NICKEL finish, RECTANGLE contact config. Ideal for Chip Carrier IC & Component Sockets applications.
2-1437506-0 by TE Connectivity

2-1437506-0

TE Connectivity

IC SOCKET; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; No. of Contacts: 1; Termination Type: PRESS FIT;
XR2D-0801-N by Omron

XR2D-0801-N

Omron

IC SOCKET; Contact Finish (Mating): GOLD (30); Contact Finish (Termination): Gold (Au); Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4;
RSE120159 by Amphenol

RSE120159

Amphenol

RELAY SOCKET; Housing Material: POLYETHERIMIDE; JESD-609 Code: e4; Contact Finish (Mating): GOLD; Contact Finish (Termination): GOLD; Additional Features: LOW PROFILE;
416-43-226-41-003000 by Mill-max Mfg

416-43-226-41-003000

Mill-max Mfg

416-43-226-41-003000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP26 devices with 26 contacts and TIN finish. It features RECTANGLE contact configuration, suitable for Chip Carrier IC & Component Sockets applications.
M12883/40-01 by Amphenol

M12883/40-01

Amphenol

RELAY SOCKET; Device Type Used On: RELAY; Housing Material: POLYETHERIMIDE; No. of Contacts: 14; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD;
390261-2 by Tyco Electronics Amp

390261-2

Tyco Electronics Amp

IC SOCKET; Device Type Used On: DIP8; Mounting Style: STRAIGHT; Contact Style: LEAF; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE;
APH-1508-G-T by Samtec

APH-1508-G-T

Samtec

The Samtec APH-1508-G-T is a DIP8 IC socket with 8 brass contacts and gold over nickel finish. It features a polyethylene housing material and rectangular contact configuration. Ideal for chip carrier applications, this IC socket is designed to provide reliable connections in electronic devices.
ICA-203-S-TG30 by Robinson Nugent

ICA-203-S-TG30

Robinson Nugent

IC SOCKET; Device Type Used On: DIP20; Housing Material: POLYESTER; Manufacturer Series: ICE; Additional Features: STANDARD: UL 94V-0; No. of Contacts: 20;
1047031 by Phoenix Contact

1047031

Phoenix Contact

RELAY SOCKET; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE;
XR2A-6402 by Omron

XR2A-6402

Omron

IC SOCKET; Contact Material: BERYLLIUM COPPER; Contact Finish (Termination): GOLD; JESD-609 Code: e4; Contact Finish (Mating): GOLD (30); Manufacturer Series: XR2A;
95.63 by Finder

95.63

Finder

Finder's 95.63 is a RELAY SOCKET with 5 contacts, rated at 10A current. It has a dielectric voltage of 6000VDC and operates b/w -40°C to 70°C. The socket uses SCREW termination, measures 2.677" x 0.61" x 1.398", and mounts in STRAIGHT style for Chip Carrier IC applications.