Preci-dip Sa - 612-87-314-41-001101

  1. Home
  2. Preci-dip Sa - 612-87-314-41-001101
612-87-314-41-001101 by Preci-dip Sa

Image shown is a representation only.

Manufacturer Preci-dip Sa
Manufacturer's Part Number 612-87-314-41-001101
Description IC SOCKET; Device Type Used On: DIP14; Housing Material: PCT POLYESTER; Contact Finish (Termination): Tin (Sn); Contact Finish (Mating): GOLD FLASH; No. of Contacts: 14;
Datasheet 612-87-314-41-001101 Datasheet
NAME DESCRIPTION
Contact Finish (Mating): Gold Flash
IC Socket Type: IC Socket
Contact Finish (Termination): Tin
Housing Material: Polycyclohexylene Dimethylene Terephthalate (PCT)
Device Type Used On: DIP14
Contact Material: Beryllium Copper
Additional Features: Standard: UL 94V-0
JESD-609 Code: e3
No. of Contacts: 14
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products

240-3639-00-0602J by 3m Electronic Products Division

240-3639-00-0602J

3m Electronic Products Division

3M Electronic Products Division's 240-3639-00-0602J is a DIP40 IC socket with GLASS FILLED POLYSULFONE housing and BERYLLIUM COPPER contacts. Featuring 40 gold-over-nickel contacts, it is ideal for chip carrier applications requiring reliable connections.
342-90-139-00-591000 by Mill-max Mfg

342-90-139-00-591000

Mill-max Mfg

Mill-max Mfg's 342-90-139-00-591000 is a POLYETHYLENE chip carrier IC socket with 39 contacts. It features TIN LEAD (200) over NICKEL (150) contact finish for SIP39 devices. Ideal for applications requiring IC SOCKET with RECTANGLE contact configuration.
VCF4-1000 by TE Connectivity

VCF4-1000

TE Connectivity

IC SOCKET; Contact Finish (Mating): NOT APPLICABLE; Termination Type: SOLDER; Contact Material: NOT APPLICABLE; No. of Contacts: 1;
220-3342-00-0602J by 3m Electronic Products Division

220-3342-00-0602J

3m Electronic Products Division

The 3M Electronic Products Division's 220-3342-00-0602J is a DIP20 IC socket with GLASS FILLED POLYSULFONE housing and BERYLLIUM COPPER contacts. It features 20 gold-plated contacts for mating and termination, suitable for chip carrier applications.
614-43-964-31-012000 by Mill-max Mfg

614-43-964-31-012000

Mill-max Mfg

IC SOCKET; Device Type Used On: DIP64; Housing Material: PLASTIC; Contact Finish (Termination): MATTE TIN OVER NICKEL; No. of Contacts: 64; JESD-609 Code: e3;
YFS-20-03-H-08-SB-TR by Samtec

YFS-20-03-H-08-SB-TR

Samtec

YFS-20-03-H-08-SB-TR by Samtec is a Chip Carrier IC Socket with 160 contacts. It features Phosphor Bronze contact material and Gold over Nickel finish. Designed for BGA160 devices, it uses Liquid Crystal Polymer housing material for high performance in electronic applications.
PYFZ-14-E by Omron

PYFZ-14-E

Omron

RELAY SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE; Contact Material: NOT SPECIFIED;
2-1393143-2 by TE Connectivity

2-1393143-2

TE Connectivity

IC SOCKET; Device Type Used On: RELAY; Housing Material: POLYESTER; Termination Type: SOLDER LUG; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE;
110-44-628-41-001000 by Mill-max Mfg

110-44-628-41-001000

Mill-max Mfg

110-44-628-41-001000 by Mill-max Mfg is a POLYETHYLENE chip carrier IC socket with 28 contacts, matte tin over nickel finish. It is designed for DIP28 devices, featuring a rectangular contact configuration. Ideal for applications requiring reliable connections in electronic circuits.
4-1571552-9 by TE Connectivity

4-1571552-9

TE Connectivity

TE Connectivity's 4-1571552-9 is a Chip Carrier IC Socket with 28 contacts, Beryllium Copper material, and 15.24mm PCB row spacing. It is used for DIP28 devices in applications requiring a -55 to 105°C operating temperature range and solder termination.
416-43-226-41-006000 by Mill-max Mfg

416-43-226-41-006000

Mill-max Mfg

Mill-max Mfg's 416-43-226-41-006000 is a PLASTIC IC SOCKET for DIP26 devices with 26 contacts and TIN finish. It features RECTANGLE contact configuration, ideal for Chip Carrier IC & Component Sockets applications.
5-1393143-1 by TE Connectivity

5-1393143-1

TE Connectivity

IC SOCKET; Device Type Used On: RELAY; Housing Material: POLYESTER; Termination Type: SOLDER LUG; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE;
ICA-628-STT by Samtec

ICA-628-STT

Samtec

Samtec's ICA-628-STT is a DIP28 IC socket with 28 contacts, 15.24mm PCB row spacing, and rectangular contact pattern. It features polyester housing material, solder termination, and Tin finish for mating contacts. Ideal for applications requiring a current rating of 1A, operating temperatures from -65 to 125 °C, and dielectric voltage withstand of 1000VAC.
CQF024-165B by Texas Instruments

CQF024-165B

Texas Instruments

IC SOCKET; Device Type Used On: QFP24; Housing Material: GLASS FILLED POLYETHERIMIDE; No. of Contacts: 24; Manufacturer Series: CQF;
240-1280-00-0602J by 3m Electronic Products Division

240-1280-00-0602J

3m Electronic Products Division

The 3M Electronic Products Division's 240-1280-00-0602J is a DIP40 IC socket with GLASS FILLED POLYSULFONE housing. It features 40 BERYLLIUM COPPER contacts with GOLD (30) over NICKEL (50) finish for mating and termination. Ideal for chip carrier ICs, this socket offers reliable connectivity in electronic applications.
XR3G-2811 by Omron

XR3G-2811

Omron

IC SOCKET; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): GOLD (10); JESD-609 Code: e4; Contact Finish (Termination): GOLD;
28-6554-10 by Aries Electronics

28-6554-10

Aries Electronics

Aries Electronics 28-6554-10 is a DIP28 IC socket with 15.24mm PCB row spacing and bellowed contact style. It has 28 contacts, polyphenylene sulfide housing, and matte tin finish for solder termination. Ideal for applications requiring a 1A current rating at up to 105°C operating temperature.
PR3-BSC1/2X21 by Phoenix Contact

PR3-BSC1/2X21

Phoenix Contact

RELAY SOCKET;
228-1290-09-0602J by 3m Electronic Products Division

228-1290-09-0602J

3m Electronic Products Division

The 3M Electronic Products Division's 228-1290-09-0602J is a DIP28 IC socket with GLASS FILLED POLYSULFONE housing and BERYLLIUM COPPER contacts. It features 28 gold (30) over nickel (50) contacts for reliable connections. Ideal for chip carrier applications requiring secure component sockets.
PY08QN by Omron

PY08QN

Omron

RELAY SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE;