Renesas Electronics - 70T3799MS166BBG8

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70T3799MS166BBG8 by Renesas Electronics

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Manufacturer Renesas Electronics
Manufacturer's Part Number 70T3799MS166BBG8
Description MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE; Additional Features: PIPELINED OR FLOW-THROUGH ARCHITECTURE;
Datasheet 70T3799MS166BBG8 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 128KX72
Minimum Supply Voltage (Vsup): 2.4 V
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 324
No. of Words: 131072 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: S-PBGA-B324
Package Shape: SQUARE
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 70 Cel
Package Code: BGA
Memory Density: 9437184 bit
Memory IC Type: MULTI-PORT SRAM
JESD-609 Code: e1
Minimum Operating Temperature: 0 Cel
Memory Width: 72
No. of Functions: 1
Maximum Access Time: 12 ns
No. of Words Code: 128K
Nominal Supply Voltage / Vsup (V): 2.5
Additional Features: PIPELINED OR FLOW-THROUGH ARCHITECTURE
Parallel or Serial: PARALLEL
Temperature Grade: COMMERCIAL
Maximum Supply Voltage (Vsup): 2.6 V
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