71V3577S75BQI by Renesas Electronics | Memory ICs

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Manufacturer	Renesas Electronics
Manufacturer's Part Number	71V3577S75BQI
Description	STANDARD SRAM; No. of Terminals: 165; Package Code: TBGA; Package Shape: RECTANGULAR; Terminal Finish: TIN LEAD; Package Style (Meter): GRID ARRAY, THIN PROFILE;
Datasheet	71V3577S75BQI Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.035 Amp
Organization:	128KX36
Output Characteristics:	3-STATE
Maximum Time At Peak Reflow Temperature (s):	30
Maximum Seated Height:	1.2 mm
Minimum Supply Voltage (Vsup):	3.135 V
Surface Mount:	YES
Maximum Supply Current:	265 mA
Terminal Finish:	TIN LEAD
No. of Terminals:	165
Maximum Clock Frequency (fCLK):	117 MHz
No. of Words:	131072 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, THIN PROFILE
Technology:	CMOS
JESD-30 Code:	R-PBGA-B165
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	85 Cel
Package Code:	TBGA
Width:	13 mm
Moisture Sensitivity Level (MSL):	3
Input/Output Type:	COMMON
No. of Ports:	1
Memory Density:	4718592 bit
Minimum Standby Voltage:	3.14 V
Memory IC Type:	STANDARD SRAM
JESD-609 Code:	e0
Minimum Operating Temperature:	-40 Cel
Memory Width:	36
Output Enable:	YES
No. of Functions:	1
Package Equivalence Code:	BGA165,11X15,40
Length:	15 mm
Maximum Access Time:	7.5 ns
No. of Words Code:	128K
Nominal Supply Voltage / Vsup (V):	3.3
Additional Features:	FLOW THROUGH ARCHITECTURE
Peak Reflow Temperature (C):	225
Parallel or Serial:	PARALLEL
Terminal Pitch:	1 mm
Maximum Supply Voltage (Vsup):	3.465 V
Reverse Pinout:	NO

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