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Manufacturer | Renesas Electronics |
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Manufacturer's Part Number | 72T6360L7.5BBGI |
Description | MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE; |
Datasheet | 72T6360L7.5BBGI Datasheet |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 2.375 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 2.5 V |
Maximum Seated Height: | 1.97 mm |
Surface Mount: | YES |
Terminal Finish: | TIN SILVER COPPER |
No. of Terminals: | 324 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B324 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Package Code: | BGA |
Width: | 19 mm |
Moisture Sensitivity Level (MSL): | 3 |
Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
Maximum Supply Voltage: | 2.625 V |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | -40 Cel |
Qualification: | Not Qualified |
Length: | 19 mm |
Terminal Pitch: | 1 mm |
Temperature Grade: | INDUSTRIAL |