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| Manufacturer | Renesas Electronics |
|---|---|
| Manufacturer's Part Number | 80HCPS1616CHMGI |
| Description | TELECOM CIRCUIT; Terminal Form: BALL; No. of Terminals: 400; Package Code: HBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG; |
| Datasheet | 80HCPS1616CHMGI Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1 V |
| Telecom IC Type: | TELECOM CIRCUIT |
| Maximum Seated Height: | 2.83 mm |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 400 |
| Package Equivalence Code: | BGA400,20X20,40 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, HEAT SINK/SLUG |
| Data Rate: | 80000 Mbps |
| Length: | 21 mm |
| JESD-30 Code: | S-PBGA-B400 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Peak Reflow Temperature (C): | 245 |
| Package Code: | HBGA |
| Width: | 21 mm |
| Terminal Pitch: | 1 mm |
| Moisture Sensitivity Level (MSL): | 4 |
