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Manufacturer | Renesas Electronics |
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Manufacturer's Part Number | 80HCPS1616CRM |
Description | TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE; |
Datasheet | 80HCPS1616CRM Datasheet |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 1 V |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Seated Height: | 2.83 mm |
Sub-Category: | Other Telecom ICs |
Surface Mount: | YES |
Maximum Supply Current: | 4730 mA |
Terminal Finish: | TIN SILVER COPPER |
No. of Terminals: | 400 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
JESD-30 Code: | S-PBGA-B400 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 70 Cel |
Package Code: | BGA |
Width: | 21 mm |
Moisture Sensitivity Level (MSL): | 4 |
Telecom IC Type: | TELECOM CIRCUIT |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | 0 Cel |
No. of Functions: | 1 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA400,20X20,40 |
Length: | 21 mm |
Peak Reflow Temperature (C): | 245 |
Terminal Pitch: | 1 mm |
Temperature Grade: | COMMERCIAL |
Power Supplies (V): | 1,2.5/3.3 |