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Manufacturer | Renesas Electronics |
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Manufacturer's Part Number | F1358NBGI8 |
Description | TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 36; Package Code: HVQCCN; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; |
Datasheet | F1358NBGI8 Datasheet |
NAME | DESCRIPTION |
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Package Body Material: | UNSPECIFIED |
Nominal Supply Voltage: | 5 V |
Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
Maximum Seated Height: | .8 mm |
Sub-Category: | Other Telecom ICs |
Surface Mount: | YES |
Maximum Supply Current: | .25 mA |
Terminal Finish: | Matte Tin (Sn) |
No. of Terminals: | 36 |
Terminal Position: | QUAD |
Package Style (Meter): | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
JESD-30 Code: | S-XQCC-N36 |
Package Shape: | SQUARE |
Terminal Form: | NO LEAD |
Package Code: | HVQCCN |
Width: | 6 mm |
Moisture Sensitivity Level (MSL): | 1 |
Telecom IC Type: | TELECOM CIRCUIT |
JESD-609 Code: | e3 |
No. of Functions: | 1 |
Qualification: | Not Qualified |
Package Equivalence Code: | LCC36,.25SQ,20 |
Length: | 6 mm |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | .5 mm |
Power Supplies (V): | 5 |