Image shown is a representation only.
| Manufacturer | Renesas Electronics |
|---|---|
| Manufacturer's Part Number | F1358NBGI8 |
| Description | TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 36; Package Code: HVQCCN; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; |
| Datasheet | F1358NBGI8 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | UNSPECIFIED |
| Nominal Supply Voltage: | 5 V |
| Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
| Maximum Seated Height: | .8 mm |
| Sub-Category: | Other Telecom ICs |
| Surface Mount: | YES |
| Maximum Supply Current: | .25 mA |
| Terminal Finish: | Matte Tin (Sn) |
| No. of Terminals: | 36 |
| Terminal Position: | QUAD |
| Package Style (Meter): | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| JESD-30 Code: | S-XQCC-N36 |
| Package Shape: | SQUARE |
| Terminal Form: | NO LEAD |
| Package Code: | HVQCCN |
| Width: | 6 mm |
| Moisture Sensitivity Level (MSL): | 1 |
| Telecom IC Type: | TELECOM CIRCUIT |
| JESD-609 Code: | e3 |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | LCC36,.25SQ,20 |
| Length: | 6 mm |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .5 mm |
| Power Supplies (V): | 5 |
