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Manufacturer | Renesas Electronics |
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Manufacturer's Part Number | HD6417705BP133BV |
Description | MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 208; Package Code: FBGA; Package Shape: SQUARE; |
Datasheet | HD6417705BP133BV Datasheet |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Speed: | 133 rpm |
Peripheral IC Type: | MICROPROCESSOR, RISC |
Sub-Category: | Microprocessors |
Surface Mount: | YES |
Bit Size: | 32 |
Maximum Supply Current: | 200 mA |
Minimum Operating Temperature: | -20 Cel |
No. of Terminals: | 208 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA208,17X17,25 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, FINE PITCH |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B208 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 70 Cel |
Package Code: | FBGA |
Terminal Pitch: | .635 mm |
Temperature Grade: | COMMERCIAL |
Power Supplies (V): | 1.5,3.3 |