Renesas Electronics - HJ932020

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HJ932020 by Renesas Electronics

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Manufacturer Renesas Electronics
Manufacturer's Part Number HJ932020
Description MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 273; Package Code: FBGA; Package Shape: RECTANGULAR; Terminal Position: BOTTOM;
Datasheet HJ932020 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Nominal Supply Voltage: 1.9 V
Maximum Seated Height: 1.9 mm
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
JESD-609 Code: e1
No. of Terminals: 273
Qualification: Not Qualified
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Length: 19 mm
Technology: CMOS
JESD-30 Code: R-PBGA-B273
Package Shape: RECTANGULAR
Terminal Form: BALL
Additional Features: IT REQUIRES 1.8V SUPPLY FOR 100 MHZ MODELS
Package Code: FBGA
Width: 13 mm
Terminal Pitch: .8 mm
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