Renesas Electronics - HM5251325CBP-75

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HM5251325CBP-75 by Renesas Electronics

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Manufacturer Renesas Electronics
Manufacturer's Part Number HM5251325CBP-75
Description SYNCHRONOUS DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 108; Package Code: BGA; Package Shape: RECTANGULAR; Qualification: Not Qualified;
Datasheet HM5251325CBP-75 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 16MX32
Maximum Seated Height: 2.35 mm
Access Mode: FOUR BANK PAGE BURST
Minimum Supply Voltage (Vsup): 3 V
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 108
No. of Words: 16777216 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: R-PBGA-B108
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 70 Cel
Package Code: BGA
Width: 14 mm
No. of Ports: 1
Memory Density: 536870912 bit
Self Refresh: YES
Memory IC Type: SYNCHRONOUS DRAM
JESD-609 Code: e1
Minimum Operating Temperature: 0 Cel
Memory Width: 32
No. of Functions: 1
Qualification: Not Qualified
Length: 22 mm
Maximum Access Time: 6 ns
No. of Words Code: 16M
Nominal Supply Voltage / Vsup (V): 3.3
Additional Features: AUTO/SELF REFRESH
Terminal Pitch: 1.27 mm
Temperature Grade: COMMERCIAL
Maximum Supply Voltage (Vsup): 3.6 V
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