IDT70T3719MS133BBGI by Renesas Electronics | Memory ICs

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Manufacturer	Renesas Electronics
Manufacturer's Part Number	IDT70T3719MS133BBGI
Description	MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE; Memory Density: 18874368 bit;
Datasheet	IDT70T3719MS133BBGI Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.025 Amp
Organization:	256KX72
Output Characteristics:	3-STATE
Minimum Supply Voltage (Vsup):	2.4 V
Sub-Category:	SRAMs
Surface Mount:	YES
Maximum Supply Current:	900 mA
Terminal Finish:	TIN SILVER COPPER
No. of Terminals:	324
Maximum Clock Frequency (fCLK):	133 MHz
No. of Words:	262144 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
Technology:	CMOS
JESD-30 Code:	S-PBGA-B324
Package Shape:	SQUARE
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	85 Cel
Package Code:	BGA
Moisture Sensitivity Level (MSL):	3
Input/Output Type:	COMMON
No. of Ports:	2
Memory Density:	18874368 bit
Minimum Standby Voltage:	2.4 V
Memory IC Type:	MULTI-PORT SRAM
JESD-609 Code:	e1
Minimum Operating Temperature:	-40 Cel
Memory Width:	72
No. of Functions:	1
Qualification:	Not Qualified
Package Equivalence Code:	BGA324,18X18,40
Maximum Access Time:	15 ns
No. of Words Code:	256K
Nominal Supply Voltage / Vsup (V):	2.5
Additional Features:	PIPELINED OR FLOW-THRIOUGH ARCHITECTURE
Parallel or Serial:	PARALLEL
Terminal Pitch:	1 mm
Temperature Grade:	INDUSTRIAL
Maximum Supply Voltage (Vsup):	2.6 V
Power Supplies (V):	2.5,2.5/3.3

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