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| Manufacturer | Renesas Electronics |
|---|---|
| Manufacturer's Part Number | MC-2311100F9-B10-BQ1 |
| Description | MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 61; Package Code: TFBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY; |
| Datasheet | MC-2311100F9-B10-BQ1 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 1MX16 |
| Maximum Seated Height: | 1.2 mm |
| Minimum Supply Voltage (Vsup): | 2.6 V |
| Surface Mount: | YES |
| No. of Terminals: | 61 |
| No. of Words: | 1048576 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B61 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Operating Mode: | ASYNCHRONOUS |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | TFBGA |
| Width: | 7 mm |
| Memory Density: | 16777216 bit |
| Memory IC Type: | MEMORY CIRCUIT |
| Minimum Operating Temperature: | -20 Cel |
| Memory Width: | 16 |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Length: | 9 mm |
| No. of Words Code: | 1M |
| Additional Features: | SRAM CONFIGURATION IS 256K X 16 |
| Terminal Pitch: | .8 mm |
| Temperature Grade: | COMMERCIAL |
| Maximum Supply Voltage (Vsup): | 3 V |
