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| Manufacturer | Renesas Electronics |
|---|---|
| Manufacturer's Part Number | MC-242444F9-B90-BT3 |
| Description | MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 77; Package Code: FBGA; Package Shape: RECTANGULAR; Terminal Pitch: .8 mm; |
| Datasheet | MC-242444F9-B90-BT3 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .00001 Amp |
| Mixed Memory Type: | FLASH+SRAM |
| Sub-Category: | Other Memory ICs |
| Surface Mount: | YES |
| Maximum Supply Current: | 45 mA |
| Memory IC Type: | MEMORY CIRCUIT |
| Minimum Operating Temperature: | -20 Cel |
| No. of Terminals: | 77 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA77,8X14,32 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, FINE PITCH |
| Technology: | HYBRID |
| Maximum Access Time: | 80 ns |
| JESD-30 Code: | R-PBGA-B77 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | FBGA |
| Terminal Pitch: | .8 mm |
| Temperature Grade: | COMMERCIAL |
| Power Supplies (V): | 2.6/3 |
