Renesas Electronics - UPD30111S1-70-3C

UPD30111S1-70-3C by Renesas Electronics

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Manufacturer Renesas Electronics
Manufacturer's Part Number UPD30111S1-70-3C
Description MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 224; Package Code: FBGA; Package Shape: SQUARE;
Datasheet UPD30111S1-70-3C Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Speed: 70 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Sub-Category: Microprocessors
Surface Mount: YES
Bit Size: 32
Maximum Supply Current: 140 mA
Minimum Operating Temperature: -10 Cel
No. of Terminals: 224
Qualification: Not Qualified
Package Equivalence Code: BGA224,18X18,32
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Technology: CMOS
JESD-30 Code: S-PBGA-B224
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 70 Cel
Package Code: FBGA
Terminal Pitch: .8 mm
Temperature Grade: COMMERCIAL
Power Supplies (V): 2.5,3.3
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