Renesas Electronics - UPD30131F1-200-GA2-A

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UPD30131F1-200-GA2-A by Renesas Electronics

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Manufacturer Renesas Electronics
Manufacturer's Part Number UPD30131F1-200-GA2-A
Description MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 224; Package Code: FBGA; Package Shape: SQUARE;
Datasheet UPD30131F1-200-GA2-A Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s): 10
Sub-Category: Microprocessors
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 224
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Technology: CMOS
JESD-30 Code: S-PBGA-B224
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: FBGA
Moisture Sensitivity Level (MSL): 3
Speed: 200 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Bit Size: 32
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA224,18X18,32
Peak Reflow Temperature (C): 260
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 1.5,3.3
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