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| Manufacturer | Samsung |
|---|---|
| Manufacturer's Part Number | K1C3216B2E-BI700 |
| Description | DRAMs; Temperature Grade: INDUSTRIAL; No. of Terminals: 54; Package Code: FBGA; Package Shape: RECTANGULAR; Memory Density: 33554432 bit; |
| Datasheet | K1C3216B2E-BI700 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .00003 Amp |
| Organization: | 2MX16 |
| Output Characteristics: | 3-STATE |
| Sub-Category: | Other Memory ICs |
| Surface Mount: | YES |
| Maximum Supply Current: | 35 mA |
| Terminal Finish: | TIN SILVER COPPER |
| No. of Terminals: | 54 |
| No. of Words: | 2097152 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B54 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | FBGA |
| Moisture Sensitivity Level (MSL): | 3 |
| Input/Output Type: | COMMON |
| Memory Density: | 33554432 bit |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 16 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA54,6X9,32 |
| Maximum Access Time: | 70 ns |
| No. of Words Code: | 2M |
| Nominal Supply Voltage / Vsup (V): | 1.8 |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .8 mm |
| Temperature Grade: | INDUSTRIAL |
| Power Supplies (V): | 1.8 |
