Samsung - K4B2G0446E-MCH9

  1. Home
  2. Samsung - K4B2G0446E-MCH9
K4B2G0446E-MCH9 by Samsung

Image shown is a representation only.

Manufacturer Samsung
Manufacturer's Part Number K4B2G0446E-MCH9
Description DDR3 DRAM; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
Datasheet K4B2G0446E-MCH9 Datasheet
NAME DESCRIPTION
Peak Reflow Temperature (C): 260
Memory IC Type: DDR3 DRAM
Moisture Sensitivity Level (MSL): 3
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products

MT48LC16M16A2B4-7E:G by Micron Technology

MT48LC16M16A2B4-7E:G

Micron Technology

Micron Technology's MT48LC16M16A2B4-7E:G is a 16MX16 DRAM with 3.3V supply, 143 MHz clock frequency, and 5.4 ns access time. Ideal for commercial applications requiring high-speed memory with common I/O type and self-refresh capability in a compact grid array package.
SQR-SD3I-8G1K6SNLB by Advantech

SQR-SD3I-8G1K6SNLB

Advantech

Advantech's SQR-SD3I-8G1K6SNLB DDR3L DRAM Module features 8GX1 organization, 204 terminals, and operates at 1.35V. Ideal for applications requiring high memory density and reliable performance in a wide temperature range from -40 to 85°C.
M378T5663RZ3-CF7 by Samsung

M378T5663RZ3-CF7

Samsung

Samsung M378T5663RZ3-CF7 DDR DRAM with 256MX8 organization, 400 MHz clock frequency, and 1.8V supply voltage is ideal for high-speed computing applications. Featuring synchronous operation and self-refresh capability, it offers efficient performance in dual bank page burst access mode.
W631GU6NB-09 by Winbond Electronics

W631GU6NB-09

Winbond Electronics

The Winbond Electronics W631GU6NB-09 is a DDR3L DRAM with 64MX16 organization, operating at 1066 MHz. It features synchronous operation, self-refresh capability, and a max clock frequency of 1066 MHz. Ideal for applications requiring high-speed memory access in devices such as laptops, tablets, and networking equipment.
MT41J64M16JT-15EIT:GTR by Micron Technology

MT41J64M16JT-15EIT:GTR

Micron Technology

Micron Technology's MT41J64M16JT-15EIT:GTR is a DDR3 DRAM with 64MX16 organization, operating at 1.5V. It features synchronous operation, self-refresh capability, and multi-bank page burst access mode. Ideal for applications requiring high memory density and fast data access in thin profile devices.
MT41J128M16JT-125:KTR by Micron Technology

MT41J128M16JT-125:KTR

Micron Technology

Micron Technology's MT41J128M16JT-125:KTR is a DDR3 DRAM with 128MX16 organization, operating at 1.5V. It features synchronous operation, self-refresh capability, and a memory density of 2Gb. Ideal for applications requiring high-speed data processing in devices like computers and servers.
S27KS0642GABHI023 by Cypress Semiconductor

S27KS0642GABHI023

Cypress Semiconductor

HYPERRAM; No. of Terminals: 24; Package Code: VBGA; Package Shape: RECTANGULAR; Length: 8 mm; No. of Ports: 1;
MT40A256M16LY-075:F by Micron Technology

MT40A256M16LY-075:F

Micron Technology

Micron Technology's MT40A256M16LY-075:F is a DDR4 DRAM with 256MX16 organization, operating at 1.2V. It features synchronous operation, self-refresh capability, and dual bank page burst access mode. Ideal for applications requiring high memory density and fast data processing in devices like smartphones and computers.
IS43DR16160A-3DBLI-TR by Integrated Silicon Solution

IS43DR16160A-3DBLI-TR

Integrated Silicon Solution

IS43DR16160A-3DBLI-TR by Integrated Silicon Solution is a 16MX16 DDR2 DRAM with 333 MHz clock frequency. Operating at 1.8V, it offers 16M words and supports synchronous mode with self-refresh capability. Ideal for industrial applications requiring high memory density and fast access times.
MT53E1G16D1FW-046AIT:A by Micron Technology

MT53E1G16D1FW-046AIT:A

Micron Technology

LPDDR4 DRAM;
MT46H32M16LFBF-6AT:B by Micron Technology

MT46H32M16LFBF-6AT:B

Micron Technology

Micron Technology's MT46H32M16LFBF-6AT:B is a DDR1 DRAM with 32MX16 organization, operating at 1.8V. It features synchronous operation, self-refresh capability, and industrial temperature grade suitability. This memory IC has a memory density of 536870912 bits and an access time of 5ns, making it ideal for high-performance applications requiring fast data processing.
MT41K512M16HA-125:ATR by Micron Technology

MT41K512M16HA-125:ATR

Micron Technology

DDR3L DRAM; JESD-609 Code: e1; Terminal Finish: TIN SILVER COPPER;
MT41K256M16HA-125 by Micron Technology

MT41K256M16HA-125

Micron Technology

Micron Technology's MT41K256M16HA-125 is a DDR3L DRAM with 256MX16 organization, operating at 1.35V. It features synchronous mode, self-refresh capability, and multi-bank page burst access. Ideal for applications requiring high memory density and fast data processing in compact devices due to its thin profile and fine pitch package style.
MT48LC16M16A2BG-75IT:DTR by Micron Technology

MT48LC16M16A2BG-75IT:DTR

Micron Technology

Micron Technology's MT48LC16M16A2BG-75IT:DTR is a 16MX16 Synchronous DRAM with 268Mbit memory density. It operates at 3.3V, has a max access time of 5.4ns, and supports four bank page burst access mode. Ideal for industrial applications requiring high-speed memory with low power consumption.
AS4C256M16D3LC-12BIN by Alliance Memory

AS4C256M16D3LC-12BIN

Alliance Memory

Alliance Memory's AS4C256M16D3LC-12BIN is a 256MX16 DDR3L DRAM with 800 MHz clock frequency. Operating at 1.35V, it offers 8192 refresh cycles and supports multi-bank page burst access mode. Ideal for applications requiring high memory density and fast data processing in a compact form factor.
IS42S16160J-6BLI by Integrated Silicon Solution

IS42S16160J-6BLI

Integrated Silicon Solution

IS42S16160J-6BLI by Integrated Silicon Solution is a 16MX16 Synchronous DRAM with 268Mbit memory density. It operates at 3.3V, has a max access time of 5.4ns, and supports self-refresh mode. Ideal for industrial applications requiring fast and reliable memory performance in a compact grid array package.
S27KL0642GABHI020 by Infineon Technologies

S27KL0642GABHI020

Infineon Technologies

Infineon's S27KL0642GABHI020 DRAM features 8MX8 organization, 200 MHz clock frequency, and 67108864 bit memory density. Ideal for applications requiring high-speed synchronous operation with common I/O type and self-refresh capability. Package style is grid array with very thin profile, suitable for compact designs in various electronic devices.
IS46TR16256BL-125KBLA2-TR by Integrated Silicon Solution

IS46TR16256BL-125KBLA2-TR

Integrated Silicon Solution

IS46TR16256BL-125KBLA2-TR by Integrated Silicon Solution is a DDR3L DRAM with 256MX16 organization, operating at up to 800 MHz clock frequency. It features synchronous operation, self-refresh capability, and common I/O type. Ideal for applications requiring high memory density and fast data processing in a compact form factor.
MT4C4M4B1DJ-6 by Micron Technology

MT4C4M4B1DJ-6

Micron Technology

MT4C4M4B1DJ-6 by Micron Technology is a 4MX4 DRAM with 3-STATE output, operating at 5V. It features a small outline package, synchronous mode, and fast page access. Ideal for commercial applications requiring high memory density and fast data retrieval within temperature range of 0 to 70°C.
MT40A2G16SKL-062E:B by Micron Technology

MT40A2G16SKL-062E:B

Micron Technology

Micron Technology's MT40A2G16SKL-062E:B is a DDR4 DRAM with 2GX16 organization, operating at 1600 MHz. It features a thin profile grid array package and operates synchronously with self-refresh capability. Ideal for applications requiring high-speed memory performance in devices like computers and servers.