K4B4G1646B-HYK00 by Samsung | Memory ICs

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Manufacturer	Samsung
Manufacturer's Part Number	K4B4G1646B-HYK00
Description	DDR3 DRAM; No. of Terminals: 78; Package Code: BGA; Package Shape: RECTANGULAR; Surface Mount: YES; Access Mode: MULTI BANK PAGE BURST;
Datasheet	K4B4G1646B-HYK00 Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Memory Density:	4294967296 bit
Organization:	256MX16
Access Mode:	MULTI BANK PAGE BURST
Surface Mount:	YES
Memory IC Type:	DDR3 DRAM
Memory Width:	16
No. of Functions:	1
No. of Terminals:	78
No. of Words:	268435456 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
Technology:	CMOS
No. of Words Code:	256M
JESD-30 Code:	R-PBGA-B78
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	ASYNCHRONOUS
Nominal Supply Voltage / Vsup (V):	1.35
Package Code:	BGA

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