Samsung - K4X1G163PE-FGC3

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K4X1G163PE-FGC3 by Samsung

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Manufacturer Samsung
Manufacturer's Part Number K4X1G163PE-FGC3
Description DDR1 DRAM; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 60; Package Shape: RECTANGULAR; Terminal Form: BALL; Maximum Operating Temperature: 70 Cel;
Datasheet K4X1G163PE-FGC3 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 64MX16
Access Mode: FOUR BANK PAGE BURST
Surface Mount: YES
No. of Terminals: 60
Maximum Clock Frequency (fCLK): 133 MHz
No. of Words: 67108864 words
Terminal Position: BOTTOM
Technology: CMOS
JESD-30 Code: R-PBGA-B60
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 70 Cel
Moisture Sensitivity Level (MSL): 3
No. of Ports: 1
Memory Density: 1073741824 bit
Memory IC Type: DDR1 DRAM
Minimum Operating Temperature: -25 Cel
Memory Width: 16
No. of Functions: 1
No. of Words Code: 64M
Nominal Supply Voltage / Vsup (V): 1.8
Peak Reflow Temperature (C): 260
Temperature Grade: COMMERCIAL EXTENDED
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