K524G2GACB-A050 by Samsung | Memory ICs

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Manufacturer	Samsung
Manufacturer's Part Number	K524G2GACB-A050
Description	DDR1 DRAM; Temperature Grade: OTHER; No. of Terminals: 137; Package Code: TFBGA; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 1.7 V;
Datasheet	K524G2GACB-A050 Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.002 Amp
Organization:	64MX16
Maximum Seated Height:	1.2 mm
Access Mode:	MULTI BANK PAGE BURST
Minimum Supply Voltage (Vsup):	1.7 V
Sub-Category:	Other Memory ICs
Surface Mount:	YES
Maximum Supply Current:	25 mA
Terminal Finish:	TIN SILVER COPPER
No. of Terminals:	137
No. of Words:	67108864 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, THIN PROFILE, FINE PITCH
Technology:	CMOS
JESD-30 Code:	R-PBGA-B137
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	85 Cel
Package Code:	TFBGA
Width:	10.5 mm
No. of Ports:	1
Memory Density:	1073741824 bit
Self Refresh:	YES
Mixed Memory Type:	FLASH+SDRAM
Memory IC Type:	DDR1 DRAM
JESD-609 Code:	e1
Minimum Operating Temperature:	-25 Cel
Memory Width:	16
No. of Functions:	1
Qualification:	Not Qualified
Package Equivalence Code:	BGA137,10X15,32
Length:	13 mm
Maximum Access Time:	5.5 ns
No. of Words Code:	64M
Nominal Supply Voltage / Vsup (V):	1.8
Additional Features:	AUTO/SELF REFRESH
Peak Reflow Temperature (C):	260
Terminal Pitch:	.8 mm
Temperature Grade:	OTHER
Maximum Supply Voltage (Vsup):	1.95 V
Power Supplies (V):	1.8

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