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Manufacturer | Samsung |
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Manufacturer's Part Number | K6F2016R3M-ZI30 |
Description | STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: VFBGA; Package Shape: RECTANGULAR; Width: 6.2 mm; |
Datasheet | K6F2016R3M-ZI30 Datasheet |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Organization: | 128KX16 |
Maximum Seated Height: | .81 mm |
Minimum Supply Voltage (Vsup): | 1.8 V |
Surface Mount: | YES |
No. of Terminals: | 48 |
No. of Words: | 131072 words |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Technology: | CMOS |
JESD-30 Code: | R-PBGA-B48 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Operating Mode: | ASYNCHRONOUS |
Maximum Operating Temperature: | 85 Cel |
Package Code: | VFBGA |
Width: | 6.2 mm |
Memory Density: | 2097152 bit |
Memory IC Type: | STANDARD SRAM |
Minimum Operating Temperature: | -40 Cel |
Memory Width: | 16 |
No. of Functions: | 1 |
Qualification: | Not Qualified |
Length: | 13.75 mm |
Maximum Access Time: | 300 ns |
No. of Words Code: | 128K |
Nominal Supply Voltage / Vsup (V): | 2 |
Parallel or Serial: | PARALLEL |
Terminal Pitch: | .75 mm |
Temperature Grade: | INDUSTRIAL |
Maximum Supply Voltage (Vsup): | 2.7 V |