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| Manufacturer | Samsung |
|---|---|
| Manufacturer's Part Number | K6F4008S2C-FF700 |
| Description | STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TFBGA; Package Shape: RECTANGULAR; Organization: 512KX8; |
| Datasheet | K6F4008S2C-FF700 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 512KX8 |
| Maximum Seated Height: | 1.2 mm |
| Minimum Supply Voltage (Vsup): | 2.3 V |
| Surface Mount: | YES |
| No. of Terminals: | 48 |
| No. of Words: | 524288 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B48 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Operating Mode: | ASYNCHRONOUS |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | TFBGA |
| Width: | 6.5 mm |
| Memory Density: | 4194304 bit |
| Memory IC Type: | STANDARD SRAM |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 8 |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Length: | 8.5 mm |
| Maximum Access Time: | 70 ns |
| No. of Words Code: | 512K |
| Nominal Supply Voltage / Vsup (V): | 2.5 |
| Parallel or Serial: | PARALLEL |
| Terminal Pitch: | .75 mm |
| Temperature Grade: | INDUSTRIAL |
| Maximum Supply Voltage (Vsup): | 2.7 V |
