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Manufacturer | Samsung |
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Manufacturer's Part Number | K8A3215EBE-FC7C |
Description | FLASH; Temperature Grade: COMMERCIAL; Package Code: BGA; Package Shape: RECTANGULAR; Terminal Form: BALL; Terminal Finish: TIN LEAD; |
Datasheet | K8A3215EBE-FC7C Datasheet |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Organization: | 2MX16 |
Programming Voltage (V): | 1.8 |
Minimum Supply Voltage (Vsup): | 1.7 V |
Surface Mount: | YES |
Terminal Finish: | TIN LEAD |
No. of Words: | 2097152 words |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
Technology: | CMOS |
JESD-30 Code: | R-PBGA-B |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Operating Mode: | SYNCHRONOUS |
Maximum Operating Temperature: | 70 Cel |
Package Code: | BGA |
Moisture Sensitivity Level (MSL): | 3 |
Memory Density: | 33554432 bit |
Memory IC Type: | FLASH |
JESD-609 Code: | e0 |
Minimum Operating Temperature: | 0 Cel |
Memory Width: | 16 |
No. of Functions: | 1 |
Qualification: | Not Qualified |
Maximum Access Time: | 80 ns |
No. of Words Code: | 2M |
Nominal Supply Voltage / Vsup (V): | 1.8 |
Peak Reflow Temperature (C): | 240 |
Parallel or Serial: | PARALLEL |
Temperature Grade: | COMMERCIAL |
Maximum Supply Voltage (Vsup): | 1.95 V |