K8D3216UBC-DI08T by Samsung | Memory ICs

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Manufacturer	Samsung
Manufacturer's Part Number	K8D3216UBC-DI08T
Description	FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: FBGA; Package Shape: RECTANGULAR; Maximum Supply Current: 50 mA;
Datasheet	K8D3216UBC-DI08T Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.000018 Amp
Organization:	2MX16
Sub-Category:	Flash Memories
Surface Mount:	YES
Maximum Supply Current:	50 mA
Command User Interface:	YES
No. of Terminals:	48
No. of Words:	2097152 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, FINE PITCH
Technology:	CMOS
JESD-30 Code:	R-PBGA-B48
No. of Sectors/Size:	8,63
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Maximum Operating Temperature:	85 Cel
Package Code:	FBGA
Boot Block:	BOTTOM
Memory Density:	33554432 bit
Sector Size (Words):	8K,64K
Toggle Bit:	YES
Memory IC Type:	FLASH
Minimum Operating Temperature:	-40 Cel
Memory Width:	16
Type:	NOR TYPE
Qualification:	Not Qualified
Package Equivalence Code:	BGA48,6X8,32
Alternate Memory Width:	8
Common Flash Interface:	YES
Maximum Access Time:	80 ns
No. of Words Code:	2M
Ready or Busy:	YES
Parallel or Serial:	PARALLEL
Terminal Pitch:	.8 mm
Temperature Grade:	INDUSTRIAL
Data Polling:	YES
Power Supplies (V):	3/3.3

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