Samsung - K8S1115EZC-FE1FT

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K8S1115EZC-FE1FT by Samsung

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Manufacturer Samsung
Manufacturer's Part Number K8S1115EZC-FE1FT
Description EEPROM CARD; Temperature Grade: OTHER; No. of Terminals: 64; Package Code: FBGA; Package Shape: RECTANGULAR; No. of Words Code: 32M;
Datasheet K8S1115EZC-FE1FT Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .00003 Amp
Organization: 32MX16
Programming Voltage (V): 2.7
Sub-Category: Flash Memories
Surface Mount: YES
Maximum Supply Current: 70 mA
Command User Interface: YES
No. of Terminals: 64
No. of Words: 33554432 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B64
No. of Sectors/Size: 512
Package Shape: RECTANGULAR
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: FBGA
Moisture Sensitivity Level (MSL): 1
Memory Density: 536870912 bit
Sector Size (Words): 64K
Toggle Bit: YES
Memory IC Type: EEPROM CARD
Minimum Operating Temperature: -25 Cel
Memory Width: 16
Type: NOR TYPE
Qualification: Not Qualified
Package Equivalence Code: BGA64,10X14,20
Common Flash Interface: YES
Maximum Access Time: 95 ns
No. of Words Code: 32M
Nominal Supply Voltage / Vsup (V): 1.8
Parallel or Serial: PARALLEL
Terminal Pitch: .5 mm
Temperature Grade: OTHER
Data Polling: YES
Power Supplies (V): 1.8
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