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Manufacturer | Samsung |
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Manufacturer's Part Number | K8S6415EBB-DE7B0 |
Description | FLASH; Temperature Grade: OTHER; No. of Terminals: 44; Package Code: VFBGA; Package Shape: RECTANGULAR; Ready or Busy: YES; |
Datasheet | K8S6415EBB-DE7B0 Datasheet |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Programming Voltage (V): | 1.8 |
Minimum Supply Voltage (Vsup): | 1.7 V |
Sub-Category: | Flash Memories |
Surface Mount: | YES |
Technology: | CMOS |
No. of Sectors/Size: | 8,127 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Operating Mode: | ASYNCHRONOUS |
Package Code: | VFBGA |
Moisture Sensitivity Level (MSL): | 2 |
Toggle Bit: | YES |
Memory Width: | 16 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA44,8X14,20 |
Additional Features: | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE |
Ready or Busy: | YES |
Terminal Pitch: | .5 mm |
Maximum Standby Current: | .00005 Amp |
Organization: | 4MX16 |
Maximum Seated Height: | 1 mm |
Maximum Supply Current: | 70 mA |
Command User Interface: | YES |
Terminal Finish: | TIN SILVER COPPER |
No. of Terminals: | 44 |
No. of Words: | 4194304 words |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
JESD-30 Code: | R-PBGA-B44 |
Maximum Operating Temperature: | 85 Cel |
Width: | 7.5 mm |
Boot Block: | BOTTOM |
Memory Density: | 67108864 bit |
Sector Size (Words): | 4K,32K |
Memory IC Type: | FLASH |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | -25 Cel |
No. of Functions: | 1 |
Type: | NOR TYPE |
Common Flash Interface: | YES |
Length: | 8.5 mm |
Maximum Access Time: | 90 ns |
No. of Words Code: | 4M |
Nominal Supply Voltage / Vsup (V): | 1.8 |
Parallel or Serial: | PARALLEL |
Temperature Grade: | OTHER |
Maximum Supply Voltage (Vsup): | 1.95 V |
Data Polling: | YES |
Power Supplies (V): | 1.8 |