K8S6415EBB-FE7B by Samsung | Memory ICs

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Manufacturer	Samsung
Manufacturer's Part Number	K8S6415EBB-FE7B
Description	FLASH; Temperature Grade: OTHER; No. of Terminals: 44; Package Code: FBGA; Package Shape: RECTANGULAR; Maximum Supply Current: 70 mA;
Datasheet	K8S6415EBB-FE7B Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.00005 Amp
Organization:	4MX16
Sub-Category:	Flash Memories
Surface Mount:	YES
Maximum Supply Current:	70 mA
Command User Interface:	YES
No. of Terminals:	44
No. of Words:	4194304 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, FINE PITCH
Technology:	CMOS
JESD-30 Code:	R-PBGA-B44
No. of Sectors/Size:	8,127
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Maximum Operating Temperature:	85 Cel
Package Code:	FBGA
Boot Block:	BOTTOM
Memory Density:	67108864 bit
Sector Size (Words):	4K,32K
Toggle Bit:	YES
Memory IC Type:	FLASH
Minimum Operating Temperature:	-25 Cel
Memory Width:	16
Type:	NOR TYPE
Qualification:	Not Qualified
Package Equivalence Code:	BGA44,8X14,20
Common Flash Interface:	YES
Maximum Access Time:	88.5 ns
No. of Words Code:	4M
Nominal Supply Voltage / Vsup (V):	1.8
Ready or Busy:	YES
Parallel or Serial:	PARALLEL
Terminal Pitch:	.5 mm
Temperature Grade:	OTHER
Data Polling:	YES
Power Supplies (V):	1.8

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